| Advantages︰ | MAJOR FEATURES:~
[1] The heating system employs the combination of the hot plats and the upper far-infrared heater. The hot plate employs the pins-supported heating mechanism to accept wafer.
[2] Our unique elevating pin design is used for hot plate pins at the preheat zone, allowing two-staged heating about the temperature profile. (PAT.P)
[3] This combination heating, different from the forced convection heating, imporves the cleanliness in the furnace and can keep lower oxygen density easily (100ppm>or=)
[4] In the furnace, wafers are transferred by our unique walking beams transfer system using tact sending. (PAT.)
[5] Wafers are loaded and unloaded by two three-axis clean robots, allowing highly clean and accurate wafer transfer,
[6] Optional components such as flux dispenser and spin coater can be built in the reflow oven. |
| Export Markets︰ | Hong Kong and Mainland China |
| Pricing︰ | USD 120,200 |
| Payment Details︰ | 100% BY L/C |
| Min Order︰ | 1 SET |
| Ship Date︰ | 60 DAYS |
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