Advantages︰ MAJOR FEATURES:~

[1] The heating system employs the combination of the hot plats and the upper far-infrared heater. The hot plate employs the pins-supported heating mechanism to accept wafer.

[2] Our unique elevating pin design is used for hot plate pins at the preheat zone, allowing two-staged heating about the temperature profile. (PAT.P)

[3] This combination heating, different from the forced convection heating, imporves the cleanliness in the furnace and can keep lower oxygen density easily (100ppm>or=)

[4] In the furnace, wafers are transferred by our unique walking beams transfer system using tact sending. (PAT.)

[5] Wafers are loaded and unloaded by two three-axis clean robots, allowing highly clean and accurate wafer transfer,

[6] Optional components such as flux dispenser and spin coater can be built in the reflow oven.

Export Markets︰ Hong Kong and Mainland China

Pricing︰ USD 120,200

Payment Details︰ 100% BY L/C

Min Order︰ 1 SET

Ship Date︰ 60 DAYS

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